The main components of electronic potting silicone include two-component silicone thermal conductive flame retardant potting glue. This material is composed of a rubber compound and a curing cross-linking agent, and the specific components are as follows:
Two-component silicone thermal conductive flame retardant potting glue: This is the main component of electronic potting silicone. It has the characteristics of no heat release, no corrosion, and low shrinkage during curing. It is suitable for various thermal conductive sealing and pouring of electronic components to form a thermal conductive insulation system.
Condensation type silicone electronic potting glue: It is made of 107 silicone rubber (α, ω-dihydroxy polydimethylsiloxane) as the main body, using methyltrimethoxysilane, dimethyldiethoxysilane, γ-aminopropyltriethoxysilane, ethyl orthosilicate and other silane coupling agents as cross-linking agents, and dibutyltin dilaurate as a catalyst. This material will produce volatile low-molecular substances during the curing process, and has a certain shrinkage rate after curing.
Addition-type silicone electronic potting glue: It is made of vinyl silicone oil as the main component, hydrogen silicone oil as the cross-linking agent, and a platinum catalyst (such as Karstedt reagent). This material does not release heat during vulcanization, does not release by-products, has a small shrinkage rate, and is suitable for occasions that require high transparency and high-precision products.
These ingredients give electronic potting silicone a variety of excellent properties, including high temperature resistance, weather resistance, good electrical insulation, thermal conductivity, flame retardancy, and environmental protection. They are widely used in the packaging and protection of electronic components to ensure the stable operation of electronic equipment in harsh environments.
