The use process of electronic potting silicone includes the following main steps:
Mixing ratio and stirring: Mix components A and B according to the specified weight ratio (usually 10:1). Add component B curing agent to the container containing component A silicone and stir evenly, ensuring that the bottom and wall of the container are stirred evenly to prevent incomplete curing.
Degassing: Put the mixed glue into a vacuum container and degas at 0.08MPa for 3 minutes to remove bubbles and ensure that no air is involved during the potting process.
Gluing: Pot the stirred and degassed glue into the components to be potted as soon as possible. Inject the necessary amount of glue, be careful not to involve bubbles, and let the glue level rise slowly after flowing along the inner wall of the shell to the bottom, and try to avoid covering the air inside.
Curing: Place the potted components in a dust-free place for curing. It can be cured at room temperature or heated. The higher the temperature, the faster the curing. It usually takes 24 hours for the coating to fully cure, and the ambient temperature and humidity have a significant impact on the curing process.
